EE Tronics Design Inc

Assembly Solutions

With our expertise in product manufacturability and testability, our engineers work closely with our customers' engineering team to assist them in releasing their new products for production faster and smarter. Our flexibility can be especially helpful on NPI projects, and our service in this area includes:

Turnkey or Consigned Materials

Quick Turn Proto in 1-3 days

Flexible Schedule

Manual or Machine Component Placement

DFM (Design For Manufacturing) &
DTFM (Design For Test and Manufacturing) Analysis

Technologies Offered:

MicroBGA and Flip Chip assembly and rework down to 0.007" (0.16 mm) pitch

0201/ LLC component placement

Large BGA 3" x 3" up to 2500 balls placement and rework.

In-house HP5DX 3D X-ray inspection

In-house Flying Probe testing for PCB assemblies

In-house CBGA/PBGA replacement and reball

Services Offered:

Turnkey service including PCB, component, enclosures, packaging materials procurement

Quick-turn PCB assembly- same day available

BGA/uBGA/CBGA/LLP/CSP/Flip Chip installation and rework

Testing services including flying probe testing and ICT

Component testing services

3D x-ray inspection for failure analysis

RMA hub

High volume oversea production (over 20 high speed SMT lines to serve your low cost low high volume needs)