Board Fabrication
Quality, Service and Technology Make Us Different.
Capabilities:
Capabilities:
- »Layer Count: 2-50 Layers
- »Maximum Board thickness: 0.2"
- »Line Width: 0.003" (0.075 mm)
- »Conventional Drill Size: 0.0098"(0.25 mm)
- »BSURFACE: HAL , Ni/Au, Preflux
- »Impedence: +/- 5%
- »Buried/Blind VIA
- »Heavy Copper: 60Z (inner/out layer)
- »CHDI: 1+N+1, 2+N+2, 3+N+3, 1+3+3+1, 1+4+4+1, Stack Vias.
- »Board Thickness: 0.0065" ~ 0.180"
- »Hasl, Reflow, Entek, Immersion gold, Electroless Gold, Depp Electrolytic Gold, Immersion Tin, Electroless Palladium
- »FR4, FR408 (High Tg), Nelco, Rogers, Flexible circuit materials.
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* Max Cu Weight planes — 6 oz
* Max Cu Weight inner layer ground planes — 3 oz * Max Cu Weight inner layer signals — 2 oz * Min Cu Weight inners — 1/2 oz * Maximum board size — 24" x 20" * Min conductor width — .005" * Minimum spacing — .005" |
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